Universal Solutions Assembly Division has State-of-the-art
infrastructure spread on 12000 Sq.Ft. of own space with high
speed automated SMT lines that include Automated Pick'n'Place
Machines, Wave Soldering Machines, Reflow Ovens, Screen Printers,
Re-Work Stations and Testing Equipment.
We have highly skilled manual Thruhole Assembly
line capable of placing Components as per the specifications
of the Customer.
We are capable of placing over 7 million components
per month and have the Technical capability to place 12
million Components. We have attained BGA and Flip chip capabilities.
We have got very good infrastructure on through-hole
as well as SMT to manufacture all kinds of printed circuit
boards.
